Chemical Dipping

  • Chemical dipping equipment is developed to weaken mouldflahes on the leadframe leads and heatsink of the microchips without damaging the package mould compound.
  • After chemical dipping remaining mould flashes can be easily removed by high pressure waterjet .

For more details, please contact us. We are happy to help you with your request.

Contact us

Arveon Team
Need advice?
Contact one of our colleagues:
) +31 (0)316 82 00 50